US 6,781,226 K1 (3,886th)
	Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
Jon M. Huppenthal; and D. James Guzy
Assigned to ARBOR GLOBAL STRATEGIES, LLC
Trial No. IPR2020-01022, May 29, 2020
Trial No. IPR2021-00393, Dec. 31, 2020
Trial No. IPR2020-01571, Sep. 4, 2020
Trial No. IPR2021-00738, Apr. 5, 2021
Inter Partes Review Certificate for Patent 6,781,226, issued Aug. 24, 2004, Appl. No. 10/452,113, Jun. 2, 2003
Inter Partes Review Certificate issued Feb. 20, 2025