US 7,282,951 K1 (3,887th)
	Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
Jon M. Huppenthal; and D. James Guzy
Assigned to ARBOR GLOBAL STRATEGIES, LLC
Trial No. IPR2020-01021, May 29, 2020
Trial No. IPR2021-00394, Dec. 31, 2020
Trial No. IPR2020-01568, Sep. 4, 2020
Trial No. IPR2021-00736, Apr. 5, 2021
Inter Partes Review Certificate for Patent 7,282,951, issued Oct. 16, 2007, Appl. No. 11/383,149, May 12, 2006
Inter Partes Review Certificate issued Feb. 20, 2025